Classifier Instance:

Anchor text: flat packs
Target Entity: Flatpack_\u0028electronics\u0029
Preceding Context: Like most integrated circuits of the period 1965–1990, TTL devices were usually packaged in through-hole, dual in-line packages with between 14 and 24 lead wires, usually made of epoxy plastic (PDIP) or sometimes of ceramic (CDIP). Beam-lead chip dice without packages were made for assembly into larger arrays as hybrid integrated circuits. Parts for military and aerospace applications were packaged in
Succeeding Context: , a form of surface-mount package, with leads suitable for welding or soldering to printed circuit boards. Today, many TTL-compatible devices are available in surface-mount packages, which are available in a wider array of types than through-hole packages.
Paragraph Title: Packaging
Source Page: Transistor–transistor logic

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